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Polished wafer

Polished wafer

FZ polished wafers, mainly for the production of silicon rectifier (SR), silicon controlled rectifier (SCR), Giant Transistor (GTR), thyristor (GRO)

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Polished wafer


FZ polished wafers, mainly for the production of silicon rectifier (SR), silicon controlled rectifier (SCR), Giant Transistor (GTR), thyristor (GRO)


Our advantages at a glance

1.Advanced epitaxy growth equipment and test equipment.

2.Offer the highest quality with low defect density and good surface roughness.

3.Strong research team support and technology support for our customers


FZ polished wafers Specifications


Type

Conduction type

Orientation

Diameter scope(mm)

Resistivity scope(Ω cm)

Geometric parameter graininess,surface metal

FZ

N&P

<100>&<111>

76.2-200

>1000

T260um              TTV2um              TIR2um                      STIR1um(20*20)                                Graininess10pcs(0.3um)  ,                                   20pcs(0.2um)                    Surface metal5E10/cm2 BSD:Etchpit density>1E106pcs/cm2 Poly:5000-12000 A

NTDFZ

N

<100>&<111>

76.2-200

30-800

CFZ

N&P

<100>&<111>

76.2-200

1-50

GDFZ

N&P

<100>&<111>

76.2-200

0.001-300

 


CZ polished wafers Specifications

Type

Conduction type

Orientation

Diameter scope(mm)

Resistivity scope(Ω cm)

Geometric parameter graininess,surface metal

MCZ

N&P

<100> <110>&<111>

76.2-200

1-300

T260um              TTV2um              TIR2um                      STIR1um(20*20)                                Graininess10pcs(0.3um)                                     20pcs(0.2um)                    Surface metal5E10/cm2 BSD:Etchpit density>1E106pcs/cm2 LTO:3500~8000±250A

CZ

N&P

<100> <110>&<111>

76.2-200

1-300

MCZ heavily doped

N&P

 <100>&<111>

76.2-200

0.001-1

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Subject : Polished wafer

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