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Etching wafer

Etching wafer

The etching wafer has the characteristics of low roughness, good glossiness and relatively low cost, and directly substitutes the polished wafer or epitaxial wafer which has relatively high cost to produce the electronic elements in some fields, to reduce the costs. There are the low-roughness, low-reflectivity and high-reflectivity etching wafers.

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Etching wafer


The etching wafer has the characteristics of low roughness, good glossiness and relatively low cost, and directly substitutes the polished wafer or epitaxial wafer which has relatively high cost to produce the electronic elements in some fields, to reduce the costs. There are the low-roughness, low-reflectivity and high-reflectivity etching wafers.


Our advantages at a glance

1.Advanced epitaxy growth equipment and test equipment.

2.Offer the highest quality with low defect density and good surface roughness.

3.Strong research team support and technology support for our customers


FZ etching wafers Specifications

Type

Conduction type

Orientation

Diameter scope(mm)

Resistivity scope(Ω cm)

Geometric parameter,graininess,surface metal

FZ

N&P

<100>&<111>

76.2-200

>1000

T≥180umTTV≤2umTIR≤2umthe maximum reflectivity could be 90%

NTDFZ

N

<100>&<111>

76.2-200

30-800

CFZ

N&P

<100>&<111>

76.2-200

1-50

GDFZ

N&P

<100>&<111>

76.2-200

0.001-300

 

CZ etching wafers Specifications

Type

Conduction type

Orientation

Diameter scope(mm)

Resistivity scope(Ω cm)

Geometric parameter,graininess,surface metal

MCZ

N&P

<100> <110>&<111>

76.2-200

1-300

T≥180umTTV≤2umTIR≤2umthe maximum reflectivity could be 90%

CZ

N&P

<100> <110>&<111>

76.2-200

1-300

MCZ heavily doped

N&P

<100> <110>&<111>

76.2-200

0.001-1

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Subject : Etching wafer

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