Home / Products / Compound Semiconductor /

GaSb wafer

Products
GaSb wafer GaSb wafer

GaSb wafer

Xiamen Powerway offers GaSb wafer - gallium antimonide which are grown by LEC(Liquid Encapsulated Czochralski) as epi-ready or mechanical grade with n type, p type or semi-insulating in different orientation(111)or(100)

  • MOQ :

    1
  • Product Details

Xiamen Powerway offers GaSb wafer - gallium antimonide which are grown by LEC(Liquid Encapsulated Czochralski) as epi-ready or mechanical grade with n type, p type or semi-insulating in different orientation(111)or(100).


Gallium antimonide (GaSb) is a semiconducting compound of gallium and antimony of the III-V family.It has a lattice constant of about 0.61 nm. GaSb can be used for Infrared detectors,infrared LEDs and lasers and transistors, and thermophotovoltaic systems.


Wafer Specification
Item Specifications
Wafer Diameter 2"50.5±0.5mm
3"76.2±0.4mm
4"1000.0±0.5mm
Crystal Orientation (100)±0.1°
Thickness 2"500±25um
3" 625±25um
4"1000±25um
Primary flat length 2"16±2mm
3"22±2mm
4"32.5±2.5mm
Secondary flat length 2"8±1mm
3"11±1mm
4"18±1mm
Surface Finish P/E, P/P
Package Epi-Ready,Single wafer container or CF cassette 


Electrical and Doping Specification
Conduction Type p-type p-type n-type n-type n-type
Dopant Undoped Zinc Tellurium Low tellurium High tellurium
E.D.P cm-2 2"2000
3"
5000 
2"2000
3"
5000 
2",3"1000
4"
2000 
2"1000
3",4"
2000 
2,"3",4"500
Mobility cm² V-1s-1 ≥500 450-200 3500-2000 3500-2000 3500-2000
Carrier Concentration cm-3 2*1017 1*1018 91-900*1017 2*1017 5*1017



Remark:
The Chinese government has announced new limits on the exportation of Gallium materials (such as GaAs, GaN, Ga2O3, GaP, InGaAs, and GaSb) and Germanium materials used to make semiconductor chips. Starting from August 1, 2023, exporting these materials is only allowed if we obtains a license from the Chinese Ministry of Commerce. Hope for your understanding and cooperation!


Contact Us

If you would like a quotation or more information about our products, please leave us a message, will reply you as soon as possible.
Subject : GaSb wafer

Related Products

InSb substrate

InSb wafer

Xiamen Powerway offers InSb wafer - Indium antimonide which are grown by LEC(Liquid Encapsulated Czochralski) as epi-ready or mechanical grade with n type, p type or semi-insulating in different orientation(111)or(100).

InP substrate

InP wafer

Xiamen Powerway offers InP wafer - Indium Phosphide which are grown by LEC(Liquid Encapsulated Czochralski) or VGF(Vertical Gradient Freeze) as epi-ready or mechanical grade with n type, p type or semi-insulating in different orientation(111)or(100).

InAs substrate

InAs wafer

Xiamen Powerway offers InAs wafer - Indium arsenide which are grown by LEC(Liquid Encapsulated Czochralski) as epi-ready or mechanical grade with n type, p type or semi-insulating in different orientation(111)or(100).

GaP substrate

GaP wafer

Xiamen Powerway offers GaP wafer - gallium Phosphide which are grown by LEC(Liquid Encapsulated Czochralski) as epi-ready or mechanical grade with n type, p type or semi-insulating in different orientation(111)or(100).

nanolithography

Nanofabrication

PAM-XIAMEN Offers photoresist plate with photoresist We can offer Nanolithography (photolithography):Surface preparation, Photoresist apply, Soft bake, Alignment, Exposure, Development,Hard bake, Develop inspect, Etch, Photoresist removal(strip), Final inspection.

gan on silicon

Freestanding GaN substrate

PAM-XIAMEN has established the manufacturing technology for freestanding (gallium nitride)GaN substrate wafer, which is for UHB-LED and LD. Grown by hydride vapour phase epitaxy (HVPE) technology,Our GaN substrate has low defect density.

nanofabrication

Photo Mask

PAM-XIAMEN Offers Photomasks A photo mask is a thin coating of masking material supported by a thicker substrate, and the masking material absorbs light to varying degrees and can be patterned with a custom design. The pattern is used to modulate light and transfer the pattern through the process of photolithography which is the fundamental process1

Silicon Wafer

Etching wafer

The etching wafer has the characteristics of low roughness, good glossiness and relatively low cost, and directly substitutes the polished wafer or epitaxial wafer which has relatively high cost to produce the electronic elements in some fields, to reduce the costs. There are the low-roughness, low-reflectivity and high-reflectivity etching wafers.

Contact Us

If you would like a quotation or more information about our products, please leave us a message, will reply you as soon as possible.
   
Contact Us Contact Us 
If you would like a quotation or more information about our products, please leave us a message, will reply you as soon as possible.