Home / Products / GaAs Wafer /

GaAs (Gallium Arsenide) Wafers

Products
GaAs (Gallium Arsenide) Wafers

GaAs (Gallium Arsenide) Wafers

PWAM Develops and manufactures compound semiconductor substrates-gallium arsenide crystal and wafer.We has used advanced crystal growth technology,vertical gradient freeze(VGF) and GaAs wafer processing technology,established a production line from crystal growth, cutting, grinding to  polishing processing and built a 100-class clean room for wafer cleaning and packaging.  Our GaAs wafer include  2~6 inch  ingot/wafers for LED,LD and Microelectronics applications.We are always dedicated to improve the quality of currently substates and develop large size substrates.

  • MOQ :

    1
  • Product Details

(GaAs) Gallium Arsenide Wafers


PWAM Develops and manufactures compound semiconductor substrates-gallium arsenide crystal and wafer.We has used advanced crystal growth technology,vertical gradient freeze(VGF) and GaAs wafer processing technology,established a production line from crystal growth, cutting, grinding to  polishing processing and built a 100-class clean room for wafer cleaning and packaging.  Our GaAs wafer include  2~6 inch  ingot/wafers for LED,LD and Microelectronics applications.We are always dedicated to improve the quality of currently substates and develop large size substrates.


(GaAs)Gallium Arsenide Wafers for LED Applications


Item

Specifications

Remarks

Conduction Type

SC/n-type

SC/p-type with Zn dope Available

Growth Method

VGF

Dopant

Silicon

Zn available

Wafer Diamter

2, 3 & 4 inch

Ingot or as-cut availalbe

Crystal Orientation

(100)20/60/150 off (110)

Other misorientation available

OF

EJ or US

Carrier Concentration

(0.4~2.5)E18/cm3

Resistivity at RT

(1.5~9)E-3 Ohm.cm

Mobility

1500~3000cm2/V.sec

Etch Pit Density

<5000/cm2

Laser Marking

upon request

Surface Finish

P/E or P/P

Thickness

220~450um

Epitaxy Ready

Yes

Package

Single wafer container or cassette


(GaAs)Gallium Arsenide Wafers for LD Applications


Item

Specifications

Remarks

Conduction Type

SC/n-type

Growth Method

VGF

Dopant

Silicon

Wafer Diamter

2, 3 & 4 inch

Ingot or as-cut available

Crystal Orientation

(100)20/60/150 off (110)

Other misorientation available

OF

EJ or US

Carrier Concentration

(0.4~2.5)E18/cm3

Resistivity at RT

(1.5~9)E-3 Ohm.cm

Mobility

1500~3000 cm2/V.sec

Etch Pit Density

<500/cm2

Laser Marking

upon request

Surface Finish

P/E or P/P

Thickness

220~350um

Epitaxy Ready

Yes

Package

Single wafer container or cassette


(GaAs)Gallium Arsenide Wafers,Semi-insulating for Microelectronics Applications


Item

Specifications

Remarks

Conduction Type

Insulating

Growth Method

VGF

Dopant

Undoped

Wafer Diamter

2, 3 & 4 inch

 Ingot available              

Crystal Orientation

(100)+/- 0.50

OF

EJ, US or notch

Carrier Concentration

n/a

Resistivity at RT

>1E7 Ohm.cm

Mobility

>5000 cm2/V.sec

Etch Pit Density

<8000 /cm2

Laser Marking

upon request

Surface Finish

P/P

Thickness

350~675um

Epitaxy Ready

Yes

Package

Single wafer container or cassette


6" (GaAs)Gallium Arsenide Wafers,Semi-insulating for Microelectronics Applications


Item

Specifications

Remarks

Conduction Type

Semi-insulating

Grow Method

VGF

Dopant

Undoped

Type

N

Diamater(mm)

150±0.25

Orientation

(100)00±3.00

NOTCH Orientation

010±20

NOTCH Deepth(mm)

(1-1.25)mm   890-950

Carrier Concentration

N/A

Resistivity(ohm.cm)

1.0×10or 0.8-9 x10-3

Mobility(cm2/v.s)

N/A

Dislocation

N/A

Thickness(µm)

675±25

Edge Exclusion for Bow and Warp(mm)

N/A

Bow(µm)

N/A

Warp(µm)

≤20.0

TTV(µm)

10.0

TIR(µm)

≤10.0

LFPD(µm)

N/A

Polishing

P/P  Epi-Ready


2" LT-GaAs (Low Temperature-Grown Galium Arsenide) Wafer Specifications


Item

Specifications

Remarks

Diamater(mm)

Ф 50.8mm ± 1mm

Thickness

1-2um or 2-3um

Marco Defect Density

 5 cm-2

Resistivity(300K)

>108 Ohm-cm

Carrier

0.5ps

Dislocation Density

<1x106cm-2

Useable Surface Area

80%

Polishing

Single side polished

Substrate

GaAs Substrate


* We also can provide poly crystal GaAs bar, 99.9999%(6N).


Remark:
The Chinese government has announced new limits on the exportation of Gallium materials (such as GaAs, GaN, Ga2O3, GaP, InGaAs, and GaSb) and Germanium materials used to make semiconductor chips. Starting from August 1, 2023, exporting these materials is only allowed if we obtains a license from the Chinese Ministry of Commerce. Hope for your understanding and cooperation!

Contact Us

If you would like a quotation or more information about our products, please leave us a message, will reply you as soon as possible.

Related Products

GaAs crystal

GaAs Epiwafer

We are manufacturing various types of epi wafer III-V silicon doped n-type semiconductor materials based on Ga, Al, In, As and P grown by MBE or MOCVD. We supply custom structures to meet customer specifications.please contact us for more information.

nanofabrication

Photo Mask

PAM-XIAMEN Offers Photomasks A photo mask is a thin coating of masking material supported by a thicker substrate, and the masking material absorbs light to varying degrees and can be patterned with a custom design. The pattern is used to modulate light and transfer the pattern through the process of photolithography which is the fundamental process1

GaP substrate

GaP wafer

Xiamen Powerway offers GaP wafer - gallium Phosphide which are grown by LEC(Liquid Encapsulated Czochralski) as epi-ready or mechanical grade with n type, p type or semi-insulating in different orientation(111)or(100).

Silicon Wafer

Test Wafer Monitor Wafer Dummy Wafer

PAM-XIAMEN Offers  Dummy Wafer / Test Wafer / Monitor Wafer

Silicon Wafer

Polished wafer

FZ polished wafers, mainly for the production of silicon rectifier (SR), silicon controlled rectifier (SCR), Giant Transistor (GTR), thyristor (GRO)

InAs substrate

InAs wafer

Xiamen Powerway offers InAs wafer - Indium arsenide which are grown by LEC(Liquid Encapsulated Czochralski) as epi-ready or mechanical grade with n type, p type or semi-insulating in different orientation(111)or(100).

CZT

CZT Detector

PAM-XIAMEN provides CZT based detectors by solid-state detector technology for x-ray or gamma-ray,which has better energy resolution compared with scintillation crystal based detector, including CZT Planar Detector,CZT Pixilated Detector,CZT Co-Planar Gri

CZT

CdZnTe (CZT) Wafer

Cadmium Zinc Telluride (CdZnTe or CZT) is a new semiconductor, which enables to convert radiation to electron effectively, it is mainly used in infrared thin-film epitaxy substrate,X-ray detectors and Gamma-ray detectors, laser optical modulation, high-performance solar cells and other high-tech fields.

Contact Us

If you would like a quotation or more information about our products, please leave us a message, will reply you as soon as possible.
   
Contact Us Contact Us 
If you would like a quotation or more information about our products, please leave us a message, will reply you as soon as possible.