Thermal Grade Diamand Wafers and Slices Diamond exhibits the highest thermal conductivity among all materials. Its thermal conductivity is up to 2000 W/mK which is higher a lot than that of copper. Therefore diamond wafers and slices become more and more popular in thermal management as heatspreaders,heatsinks, lithographically patterned metallization, electrical isolation between top and bottom metallization, stress relieving slits for stress free mounting etc. CVD diamond heat spreaders in various shapes,and the typical parameters are as follows: Material thermal conductivity >1000 W/mK Diameter Up to 70mm Surface Polished, lapping, as-cut Thickness 100 - 1500 µm Young's modulus 1000-1100Gpa Density 3.5g/cm3 Optical grade diamond wafers Optical grade diamond wafers are used as window for infrared beam splitters, lenses for terahertz spectroscopy and CO2 laser surgery,Brewster Windows for multi-spectral applications such as free electron lasers, multi-wavelength IR lasers or terahertz optical systems,for Units attenuated total reflection) spectroscopy,for diamond Liquid Cells.