What are you looking for?

luna@powerwaywafer.com

powerwaymaterial@gmail.com 

Home / Services / knowledge / 2.Definition of Dimensional Properties,Terminology and Methods of Silicon Carbide Wafer /

2-5.Misorientation

2.Definition of Dimensional Properties,Terminology and Methods of Silicon Carbide Wafer

Categories

RECOMMENDED PRODUCTS

Latest News

2-5.Misorientation

2018-01-08

In wafers cut intentionally “off orientation”, the angle between the projection of the normal vector to the wafers

surface onto a {0001} plane and the projection on that plane of the nearest <11-20> direction.

Contact Us

If you would like a quotation or more information about our products, please leave us a message, will reply you as soon as possible.
#

Home

#

Products

#

News

#

   
Contact Us Contact Us 
If you would like a quotation or more information about our products, please leave us a message, will reply you as soon as possible.