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2-28.WARP

2.Definition of Dimensional Properties,Terminology and Methods of Silicon Carbide Wafer

2-28.WARP

2018-01-08

Warp is the difference between the maximum and the minimum distances of the median surface of a free, un-clamped wafer from the reference plane defined above. This definition follows ASTM F657, and ASTM F1390,which deviation from a plane of a slice or wafer centerline containing both concave and convex regions.

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